Registration and assembly of integrated circuit packages
Waferboard structure and method of fabricating
Socket for direct electrical connection to an integrated circuit chip
Circuit elements that are ultrasonically welded together
Printed wiring board mounted semiconductor device having leadframe with alignment feature Patent #: 5521427
ApplicationNo. 568097 filed on 12/06/1995
US Classes:257/690, With contact or lead257/730, Outside periphery of package having specified shape or configuration257/778, Flip chip257/797, ALIGNMENT MARKS257/E21.5, Mounting semiconductor bodies in container (EPO)257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.002, Details not otherwise provided for, e.g., protection against moisture (EPO)257/E23.004Characterized by shape (EPO)
ExaminersPrimary: Crane, Sara W.
Assistant: Potter, Roy
Attorney, Agent or Firm
Foreign Patent References
International ClassH01L 023/48
AbstractA perimeter independent precision locating member (22) for a semiconductor chip (10) so that contact sites upon the chip will be reliably positioned relative to connection members (18), such as contacts or leads, so that the chip may be electrically engageable. The locating member (22) is disposed upon the surface of the semiconductor chip (10) at a specific position relative the contact sites within the perimeter (24) of the chip and being closely matable with a complementary portion of a housing that contains the connection members (18). The method of making the perimeter independent precision locating member (22) for a semiconductor chip (10) involves coating the chip with a layer of photocurable material, masking the material in relation to the contact sites so that the portion of the material that will become the locating member (22) is exposed, illuminating the exposed portion of the photocurable material, and stripping from the chip the uncured portion to define the locating member (22).