Method for making direct chip attach circuit card
June 7, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMulti-layer circuit board bonding method utilizing noble metal coated surfaces Soldering method Solder interconnection structure and process for making Low temperature controlled collapse chip attach process Solder mass having conductive encapsulating arrangement Method of forming dual height solder interconnections Plastic bottle for containing both under-pressure and non under-pressure liquids Method of manufacturing a circuit carrying substrate having coaxial via holes Direct chip attachment structure and method Patent #: 5439162 InventorsApplicationNo. 476466 filed on 06/07/1995US Classes:29/840, By metal fusion29/852, By forming conductive walled aperture in base228/180.22, Lead-less (or "bumped") device257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.174Conductive vias through substrate with or without pins, e.g., buried coaxial conductors (EPO)ExaminersPrimary: Schwartz, Larry I.Assistant: Coley, Adrian L. Attorney, Agent or FirmForeign Patent References
International ClassH05K 003/34AbstractA structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct chip mount. The chip has at least one solder ball with a cap of low melting point metal. The surface of the carrier has electrical features that are directly connected to the low melting point metal on the solder ball of the chip to form the eutectic and this way the chip is directly attached to the carrier.Other References
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