Semiconductor device in a resin package housed in a frame having high thermal conductivity
July 27, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesPin grid array package structure Method of making a resin encapsulated pin grid array with integral heatsink Overmolded semiconductor package with anchoring means Integral dam and heat sink for semiconductor device assembly Pad array semiconductor device with thermal conductor and process for making the same Area array semiconductor device having a lid with functional contacts Patent #: 5291062 InventorsApplicationNo. 281098 filed on 07/27/1994US Classes:257/687, Housing or package filled with solid or liquid electrically insulating material257/700, Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)257/706, With heat sink257/713, For integrated circuit257/787, ENCAPSULATED257/E23.069, Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)257/E23.092, Auxiliary members in encapsulations (EPO)257/E23.102Cooling facilitated by shape of device (EPO)ExaminersPrimary: Brown, Peter R.Attorney, Agent or FirmForeign Patent References
International ClassesH01L 023/08H01L 023/10 H01L 023/28 H01L 023/34 Foreign Application Priority Data1993-11-18 JPAbstractA semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.Field of SearchMultiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)With heat sink With provision for cooling the housing or its contents Flip chip Composite ceramic, or single ceramic with metal For integrated circuit With heat sink embedded in encapsulant ENCAPSULATED Housing or package filled with solid or liquid electrically insulating material HOUSING OR PACKAGE With contact or lead | |
