Vortex tube cooling system for solder reflow convection furnaces
Patent 5623829 Issued on April 29, 1997. Estimated Expiration Date: 
January 17, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 17, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesInventorsAssigneeApplicationNo. 587466 filed on 01/17/1996US Classes:62/5, VORTEX TUBE, E.G., RANQUE62/266Including article conveyer or transporterExaminersPrimary: Capossela, Ronald C.Attorney, Agent or FirmInternational ClassF25B 009/02AbstractA vortex tube cooling system is presented. The cooling system contains one or more vortex tubes connected to a supply of compressed gas, the vortex tubes providing a stream of cold gas which cools product as it emerges from a furnace. The cooling system is particularly useful for cooling circuit boards emerging from a solder reflow convection furnace. | |
