Solder interconnection
June 6, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3382221 Novel polytriazine compounds Heat resistant photoresist composition and process for preparing the same Bismaleimide triazine composition Curable resin composition Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making Record media thickness compensating mechanism Composition, coated article and method of coating Urethane-functional s-triazine crosslinking agents and curable compositions containing the same Fluorine containing dicyanate resins InventorApplicationNo. 466716 filed on 06/06/1995US Classes:524/100, Six-membered nitrogen ring having two or more ring nitrogen atoms257/772, Solder composition257/774, Via (interconnection hole) shape257/778, Flip chip257/779, Solder wettable contact, lead, or bond257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)524/101, Three oxygen atoms are directly bonded to three nuclear carbon atoms of the nitrogen ring, e.g., (iso) cyanurate, etc.528/59, From N=C=X reactant having at least two -C-NH-C(=X)- groups528/422, NITROGEN-CONTAINING REACTANT528/423Reactant contains nitrogen as a ring member of a heterocyclic ringExaminersPrimary: Seidleck, James J.Assistant: Hampton-Hightower, P. Attorney, Agent or FirmForeign Patent References
International ClassesC08K 005/34C08G 073/06 H01L 023/48 H01L 023/52 AbstractTriazine polymers obtained by reacting (a) monocyanate; and (b) dicyanate and/or prepolymers thereof are used in forming interconnection structures for bonding an integrated semiconductor device to a carrier substrate.Other References
Field of SearchNITROGEN-CONTAINING REACTANTReactant contains nitrogen as a ring member of a heterocyclic ring From N=C=X reactant having at least two -C-NH-C(=X)- groups Six-membered nitrogen ring having two or more ring nitrogen atoms Three oxygen atoms are directly bonded to three nuclear carbon atoms of the nitrogen ring, e.g., (iso) cyanurate, etc. Solder composition Via (interconnection hole) shape Solder wettable contact, lead, or bond Flip chip | |
