Process for perforating stencil printing sheet
Patent 5617787 Issued on April 8, 1997. Estimated Expiration Date: 
September 22, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 22, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3862396 3871899 Electrical stamp device with ink temperature compensation for stencil paper perforation Thermal stencil master plate and method for processing the same Stencil making device having means for controlling dot perforation density Method for manufacturing a printing master using thermosensitive stencil paper Thermal stencil plate making method Patent #: 5417156 InventorsAssigneeApplicationNo. 532243 filed on 09/22/1995US Classes:101/129, Processes101/128.4ManufactureExaminersPrimary: Burr, Edgar S.Assistant: Nguyen, Anthony H. Attorney, Agent or FirmForeign Patent References
International ClassB41M 001/12Foreign Application Priority Data1994-09-30 JPAbstractA process for perforating a stencil sheet comprising a thermoplastic resin film is disclosed which process comprises melting predetermined portions of the thermoplastic resin film with the heat from heat-generating elements to form perforations while applying a pressure to the film and under such a condition that the film is spaced away from the heat-generating elements by a close distance. According to the process of the invention, perforations through which ink passes smoothly can be formed in a stencil sheet using a thermal head and thus clear images can be obtained. | |
