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A portable partition for use in an automobile having a seat with a seat bench and a seat backrest.
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US Patent 5617787 - Process for perforating stencil printing sheet
US Patent Issued on April 8, 1997
Estimated Patent Expiration Date:
September 22, 2015Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
Estimated Patent Expiration Date:
September 22, 2015Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractA process for perforating a stencil sheet comprising a thermoplastic resin film is disclosed which process comprises melting predetermined portions of the thermoplastic resin film with the heat from heat-generating elements to form perforations while applying a pressure to the film and under such a condition that the film is spaced away from the heat-generating elements by a close distance. According to the process of the invention, perforations through which ink passes smoothly can be formed in a stencil sheet using a thermal head and thus clear images can be obtained. | InventorsAssigneeApplicationNo. 532243 filed on 09/22/1995US Classes:101/129, Processes101/128.4ManufactureField of Search101/129, Processes101/128.4, Manufacture101/128.21, Laminated and/or plural sheets and/or coated base and manufacture101/114STENCILINGExaminersPrimary: Burr, Edgar S.Assistant: Nguyen, Anthony H. Attorney, Agent or FirmUS Patent References3862396, 3871899, 5195832, Electrical stamp device with ink temperature compensation for stencil paper perforationIssued on: 03/23/1993 Inventor: Fujikawa, et al.5243906, Thermal stencil master plate and method for processing the same Issued on: 09/14/1993 Inventor: Okusawa5251567, Stencil making device having means for controlling dot perforation density Issued on: 10/12/1993 Inventor: Fuwa5415090, Method for manufacturing a printing master using thermosensitive stencil paper Issued on: 05/16/1995 Inventor: Natori, et al.5417156Thermal stencil plate making method Issued on: 05/23/1995 Inventor: Tateishi, et al. Foreign Patent References
International ClassB41M 001/12Foreign Application Priority Data1994-09-30 JP |
