Patent References 3476175 3682237 3741292 Vapor cooling device for semiconductor device Device for releasing heat Heat exchanging device with heat exchanging plates Boiling refrigerant-type cooling system Immersion cooled circuit module with improved fins Modular segment adapted to provide a passively cooled housing for heat generating electronic modules Modular multilevel electronic cabinet InventorsAssigneeApplicationNo. 501718 filed on 07/12/1995US Classes:165/104.21, Utilizing change of state165/80.3, Air cooled, including fins165/104.33, Cooling electrical device257/715, Boiling (evaporative) liquid257/722, With fins257/E23.088, Cooling by change of state, e.g., use of heat pipes (EPO)361/690, Air361/697, With heat sink or cooling fins361/700Change of physical stateExaminersPrimary: Rivell, JohnAssistant: Atkinson, Christopher Attorney, Agent or FirmForeign Patent References
International ClassF28D 015/00Foreign Application Priority Data1994-07-13 JPAbstractA power pack is mounted on the side wall of a refrigerant tank in which the internal pressure is reduced and a refrigerant is held in such a way that a heat transfer panel on which a power element is mounted can contact the refrigerant. The refrigerant boiled and gasified by heat from the contact part of the heat transfer panel 19 is guided into a radiation part planted on the top of the refrigerant tank 11. The radiation part is composed of a plurality of hollow tubular bodies having flat cross sections. The plurality of radiation tubes are laid out in parallel with each other at specified intervals, the upper ends thereof being closed and the lower ends thereof being open to the inside of the refrigerant tank so that the gasified refrigerant is guided thereinto. Here, the natural convection of the air is generated in the up/downward directions by the plurality of the radiation tubes, and the effective heat radiation is achieved thereby. | |