U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Cooling apparatus using boiling and condensing refrigerant

Patent 5613552 Issued on March 25, 1997. Estimated Expiration Date: Icon_subject July 12, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3476175

3682237

3741292

Vapor cooling device for semiconductor device
Patent #: 4027728
Issued on: 06/07/1977
Inventor: Kobayashi ,   et al.

Device for releasing heat
Patent #: 4369838
Issued on: 01/25/1983
Inventor: Asanuma ,   et al.

Heat exchanging device with heat exchanging plates
Patent #: 4549603
Issued on: 10/29/1985
Inventor: Shirai ,   et al.

Boiling refrigerant-type cooling system
Patent #: 4705102
Issued on: 11/10/1987
Inventor: Kanda ,   et al.

Immersion cooled circuit module with improved fins
Patent #: 4765397
Issued on: 08/23/1988
Inventor: Chrysler ,   et al.

Modular segment adapted to provide a passively cooled housing for heat generating electronic modules
Patent #: 4953058
Issued on: 08/28/1990
Inventor: Harris

Modular multilevel electronic cabinet
Patent #: 5105336
Issued on: 04/14/1992
Inventor: Jacoby, et al.

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Inventors

Assignee

Application

No. 501718 filed on 07/12/1995

US Classes:

165/104.21, Utilizing change of state165/80.3, Air cooled, including fins165/104.33, Cooling electrical device257/715, Boiling (evaporative) liquid257/722, With fins257/E23.088, Cooling by change of state, e.g., use of heat pipes (EPO)361/690, Air361/697, With heat sink or cooling fins361/700Change of physical state

Examiners

Primary: Rivell, John
Assistant: Atkinson, Christopher

Attorney, Agent or Firm

Foreign Patent References

  • 3132112 DE 03/13/1982
  • 59-20640 JP. 02/13/1984
  • 63-45004 JP. 11/13/1988
  • 2278896 JP 11/13/1990
  • 3231496 JP 10/13/1991
  • 4225791 JP 08/13/1992
  • 4332196 JP 11/13/1992
  • 5326774 JP. 12/13/1993
  • 6104583 JP 04/13/1994
  • 1295192 SU 03/13/1987
  • 2202681 GB 09/13/1988

International Class

F28D 015/00

Foreign Application Priority Data

1994-07-13 JP

Abstract

A power pack is mounted on the side wall of a refrigerant tank in which the internal pressure is reduced and a refrigerant is held in such a way that a heat transfer panel on which a power element is mounted can contact the refrigerant. The refrigerant boiled and gasified by heat from the contact part of the heat transfer panel 19 is guided into a radiation part planted on the top of the refrigerant tank 11. The radiation part is composed of a plurality of hollow tubular bodies having flat cross sections. The plurality of radiation tubes are laid out in parallel with each other at specified intervals, the upper ends thereof being closed and the lower ends thereof being open to the inside of the refrigerant tank so that the gasified refrigerant is guided thereinto. Here, the natural convection of the air is generated in the up/downward directions by the plurality of the radiation tubes, and the effective heat radiation is achieved thereby.

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