Method and apparatus for conditioning of chemical-mechanical polishing pads

Patent 5611943 Issued on March 18, 1997. Estimated Expiration Date:

September 29, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

2826009

Grinding machine
Patent #: 4481738
Issued on: 11/13/1984
Inventor: Tabuchi

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Conditioner for a polishing pad and method therefor
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Issued on: 08/20/1996
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Inventors

Application

No. 536467 filed on 09/29/1995

US Classes:

216/88, Using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.)156/345.12, With mechanical polishing (i.e., CMP-chemical mechanical polishing)438/692, Simultaneous (e.g., chemical-mechanical polishing, etc.)451/259, Rotary disk451/287, Planar surface abrading451/444Tool cleaner

Examiners

Primary: Kunemund, Robert
Assistant: Adjodha, Michael E.

Attorney, Agent or Firm

Blakely, Sokoloff, Taylor & Zafman

International Class

B24B 029/00

Abstract

A method and apparatus for conditioning and/or rinsing a pad in a chemical-mechanical polisher. A scoring apparatus is rotated about its center directly over the polishing pad of the chemical-mechanical polisher. The scoring apparatus scores the pad surface while rotating above the pad. Consequently the pad is conditioned in a uniform and concentric fashion.