U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Surface package type semiconductor package and method of producing semiconductor memory

Patent 5607059 Issued on March 4, 1997. Estimated Expiration Date: Icon_subject June 23, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

2251609

2446361

2611481

2674509

2814382

3042796

3399762

3405796

3454154

3625931

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Inventors

Assignee

Application

No. 264745 filed on 06/23/1994

US Classes:

206/720, Bag206/204, WITH MOISTURE ABSORBENT206/459.1, WITH INDICATOR (I.E., VARIABLE INFORMATION EXHIBITING MEANS)206/718, For aligned, contiguous components257/E23.038, Insulative substrate being used as die pad, e.g., ceramic, plastic (EPO)257/E23.054, Metallic layers on lead frames (EPO)257/E23.124, Device being completely enclosed (EPO)257/E23.126Double encapsulation or coating and encapsulation (EPO)

Examiners

Primary: Fidei, David T.

Attorney, Agent or Firm

Foreign Patent References

  • 0038179 EP. 04/25/1981
  • 0154428 EP. 09/25/1985
  • 208259 EP. 01/25/1987
  • 1140952 FR. 03/25/2013
  • 2326347 FR. 10/25/1975
  • 0922516 DE. 01/25/2013
  • 2821162 DE. 11/25/1977
  • 3624194 DE. 01/25/1987
  • 3208259 DE. 01/25/1987
  • 60-036105 JP. 06/25/1985
  • 60-036165 JP. 06/25/1985
  • 1128155 GB. 10/25/1965

International Class

B65D 073/02

Foreign Application Priority Data

1986-11-25 JP

Abstract

In surface packaging of thin resin packages such as resin molded memory ICs cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

Other References

  • Packaging Engineer vol. 28 #1 "Transparent bags foil static electricity's zap", Jan. 198
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