ApplicationNo. 264745 filed on 06/23/1994
US Classes:206/720, Bag206/204, WITH MOISTURE ABSORBENT206/459.1, WITH INDICATOR (I.E., VARIABLE INFORMATION EXHIBITING MEANS)206/718, For aligned, contiguous components257/E23.038, Insulative substrate being used as die pad, e.g., ceramic, plastic (EPO)257/E23.054, Metallic layers on lead frames (EPO)257/E23.124, Device being completely enclosed (EPO)257/E23.126Double encapsulation or coating and encapsulation (EPO)
ExaminersPrimary: Fidei, David T.
Attorney, Agent or Firm
Foreign Patent References
International ClassB65D 073/02
Foreign Application Priority Data1986-11-25 JP
AbstractIn surface packaging of thin resin packages such as resin molded memory ICs cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.