U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method and apparatus for measuring thermal warpage

Patent 5601364 Issued on February 11, 1997. Estimated Expiration Date: Icon_subject June 14, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

1346793

3292418

3566078

3614237

3762818

Multizone electrical furnace methods and apparatus
Patent #: 4011430
Issued on: 03/08/1977
Inventor: Witkin ,   et al.

General purpose rocket furnace
Patent #: 4158742
Issued on: 06/19/1979
Inventor: Aldrich ,   et al.

Environmental hood for testing printed circuit cards
Patent #: 4172993
Issued on: 10/30/1979
Inventor: Leach

Dual heater stabilization apparatus and method for a crystal oven
Patent #: 4317985
Issued on: 03/02/1982
Inventor: Wilson

Apparatus and method for indicating stress in an object
Patent #: 4378701
Issued on: 04/05/1983
Inventor: Mountain ,   et al.

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Inventor

Assignee

Application

No. 259434 filed on 06/14/1994

US Classes:

374/57, Of susceptibility to thermally induced deteriouration, flaw, or failure250/237G, Gratings (moire fringes)356/605Moire

Examiners

Primary: Gutierrez, Diego

Attorney, Agent or Firm

International Classes

G01N 017/00
G01N 003/60
G01B 011/24
G01B 011/30

Abstract

A method and apparatus for measuring thermally induced warpage in test elements such as printed wiring boards and printed wiring assemblies, including a heating chamber having a transparent window and support structure for supporting a printing wiring board in an observation orientation and position parallel to the transparent window. A glass grating placed adjacent the window and a light source shines through the window onto the printed wiring board under test. A camera is positioned for capturing images of shadow moire fringes formed over time as the oven heats up the printed wiring board or printed wiring assembly to simulate actual process conditions. A computer is used for controlling operation of the apparatus and for evaluating the captured images of the moire fringes in relation to the temperature as a function of time.

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