Method for manufacturing a magnetic head suspension provided with circuit wiring

Patent 5597496 Issued on January 28, 1997. Estimated Expiration Date:

June 6, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

3503815

Magnetic head
Patent #: 4432027
Issued on: 02/14/1984
Inventor: Higuchi

Circuiting device
Patent #: 4823217
Issued on: 04/18/1989
Inventor: Kato , et al.

Composite printed circuit board and manufacturing method thereof Patent #: 5339217
Issued on: 08/16/1994
Inventor: Cohen, et al.

Inventors

Assignee

Nippon Mektron, Limited

Application

No. 465757 filed on 06/06/1995

US Classes:

216/94, Etching using radiation (e.g., laser, electron-beam, ion-beam, etc.)216/52, MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE216/75Substrate contains elemental metal, alloy thereof, or metal compound

Examiners

Primary: Chea, Thorl

Attorney, Agent or Firm

Chilton, Alix & Van Kirk

Foreign Patent References

53-74414 JP. 07/13/1978
63-113917 JP. 05/13/1988

International Class

G11B 005/48

Foreign Application Priority Data

1994-07-15 JP

Abstract

A method of manufacturing a magnetic head suspension, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension, which includes the step of: (1) forming a laminated plate having a flexible insulating base material which has an electrically conductive layer on one surface and a springy metal layer on the other surface; (2) photoetching the electrically conductive layer of the laminated plate to form a metal mask having a desired shape which does not cover an exposed area of the flexible insulating base material; (3) removing the flexible insulating base material from the exposed area; (4) photoetching the metal mask to produce a circuit wiring pattern; (5) producing a surface protecting layer on the surface of the circuit wiring pattern; and (6) photoetching the springy metal layer and bending the springy metal layer to form a suspension having a desired shape.