Did You Know...
...that in 1800 ether was first used by partyers as a fun diversion? Sniffing the gas led to hilarious and raucous laughter as people watched each other become more and more intoxicated and silly. Several doctors independently realized the value ether would have to anesthetize surgery patients. Of those who claimed rights to the "discovery," none had a happy ending. One had a seizure and died defending his rights. Another spent his life in an asylum because he had been denied acclaim. A third became addicted to chloroform and, in a New York City jail, he soaked a cloth in the drug, severed an artery and bled to death.
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US Patent 5595526 - Method and apparatus for endpoint detection in a chemical/mechanical process for polishing a substrate
Estimated Patent Expiration Date:
November 30, 2014Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractA method for polishing the surface of a substrate that overcomes the problems inherent in the prior art. During the polishing of a substrate, a quantity is calculated which is approximately proportional to a share of the total energy the polisher is consuming. Once this calculated quantity reaches a predetermined amount, it is detected. | InventorsApplicationNo. 347813 filed on 11/30/1994US Classes:451/8, With indicating451/5, Computer controlled451/41Glass or stone abradingField of Search451/8, With indicating451/10, And feeding of tool or work holder451/11, With feeding of tool or work holder451/41, Glass or stone abrading451/9, Of tool or work holder position451/5, Computer controlled451/21, Tool wear compensation451/287, Planar surface abrading451/290Disk or wheel abraderExaminersPrimary: Rose, Robert A.Attorney, Agent or FirmUS Patent References4351029, Tool life monitoring and tracking apparatusIssued on: 09/21/1982 Inventor: Maxey , et al.5036015, Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers Issued on: 07/30/1991 Inventor: Sandhu, et al.5069002, Apparatus for endpoint detection during mechanical planarization of semiconductor wafers Issued on: 12/03/1991 Inventor: Sandhu, et al.5071421, Method for preventing damage to tissue during ultrasonic surgery Issued on: 12/10/1991 Inventor: Stahl5216843, Polishing pad conditioning apparatus for wafer planarization process Issued on: 06/08/1993 Inventor: Breivogel, et al.5245794, Audio end point detector for chemical-mechanical polishing and method therefor Issued on: 09/21/1993 Inventor: Salugsugan5308438, Endpoint detection apparatus and method for chemical/mechanical polishing Issued on: 05/03/1994 Inventor: Cote, et al.5337015In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage Issued on: 08/09/1994 Inventor: Lustig, et al. International ClassesB24B 049/00B24B 019/22 |
