Surface polishing apparatus
January 2, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of endpoint detection during chemical/mechanical planarization of semiconductor wafers Stress-free chemo-mechanical polishing agent for II-VI compound semiconductor single crystals and method of polishing Semiconductors structure precision lapping method and system Endpoint detection apparatus and method for chemical/mechanical polishing Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus Patent #: 5421769 InventorsAssigneeApplicationNo. 581997 filed on 01/02/1996US Classes:451/285, Rotary work holder451/36, Utilizing fluent abradant451/41, Glass or stone abrading451/287Planar surface abradingExaminersPrimary: Little, WillisAssistant: Morgan, Eileen P. Attorney, Agent or FirmForeign Patent References
International ClassB24B 001/00Foreign Application Priority Data1995-01-13 JPAbstractA surface polishing apparatus includes a disk-like polishing tool, a polishing solution spray mechanism, and a polishing solution suction mechanism. The polishing tool has a work surface to which a polishing solution is supplied and against which a workpiece is pressed. The polishing tool is driven/rotated to surface-polish the workpiece. The polishing solution supply mechanism is disposed on the upstream side of the workpiece in the rotational direction of the polishing tool to supply a polishing solution to the work surface of the polishing tool. The polishing solution suction mechanism is disposed on the downstream side of the workpiece in the rotational direction of the polishing tool to draw and recover the polishing solution on the work surface of the polishing tool. | |
