Patent ReferencesThree-dimensional circuit modules Stacking heatpipe for three dimensional electronic packaging Universal reconfigurable printed circuit board Patent #: 5537295 InventorsApplicationNo. 348280 filed on 11/30/1994US Classes:361/790, Stacked361/733, Selective connections361/735, Stacked361/784, Plural361/785, With separable connector or socket means361/803, Interconnection details439/44, Planar circuit overlying a second planar circuit, both adapted to be electrically connected439/66Conductor is compressible and to be sandwiched between panel circuitsExaminersPrimary: Sparks, DonaldAttorney, Agent or FirmForeign Patent References
International ClassesH01R 023/68H05K 001/11 AbstractA reconfigurable apparatus for computing systems including a set of baseboards and a family of daughtercards, together with a programmable interface to an external bus for a host system. Daughtercards attach to the baseboard through complementary connectors mounted on the baseboard and the daughtercards. In addition, daughtercards are constructed to allow stacking of daughtercards vertically. The baseboard and daughtercard approach of the present invention allows simple, incremental upgrade of installed boards by adding or replacing the daughtercards and allows simple migration to new systems by changing baseboards.Other References
Field of SearchPluralWith housing Interchangeable Having lock or interlock Selective connections Stacked With printed circuit boards With particular material With spacer Plural With separable connector or socket means Having key connection Having spring member Having flexible connector Stacked Multiple contact pins Component mounting or support means Mounting pad With discrete structure or support Plural mounting or support Interconnection details Planar circuit overlying a second planar circuit, both adapted to be electrically connected Pin having selection feature Connected by transversely inserted pin Panel member having planar surface for supporting circuit and parallel surface for supporting second circuit Including three or more contacts adapted to be selectively interconnected Panel having planar contact array with mating panel having mating planar contact array Test panel PREFORMED PANEL CIRCUIT ARRANGEMENT, E.G., PCB, ICM, DIP, CHIP, WAFER, ETC. Contacts at different distances from lead panel circuit edge Receives plural panel circuit edges With provision to conduct electricity from panel circuit to another panel circuit Conductor is compressible and to be sandwiched between panel circuits Micro panel circuit arrangement, e.g., ICM, DIP, chip, wafer, etc. Overlying second, coextensive micro panel circuit arrangement INCLUDING ELASTOMERIC OR NONMETALLIC CONDUCTIVE PORTION Between parallel conductors Adapted to be sandwiched between preformed panel circuit arrangements Plug-in carrier or adapter for removable component (e.g., "hard drive" for computer) | |