U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Lead-free alloy containing tin, silver and indium

Patent 5580520 Issued on December 3, 1996. Estimated Expiration Date: Icon_subject November 4, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

1565115

1934730

2157933

2306667

2464821

2530413

2532265

2623273

3184303

3503721

More ...

Inventors

Assignee

Application

No. 334699 filed on 11/04/1994

US Classes:

420/557, TIN BASE219/146.22Nonferrous

Examiners

Primary: Yee, Deborah

Attorney, Agent or Firm

Foreign Patent References

  • 1080838 DE. 04/13/1960
  • 58-29199 JP. 06/13/1983
  • 61-14096 JP. 01/13/1986
  • 2-217193 JP. 08/13/1990
  • 2-197396 JP. 08/13/1990
  • 4-2739 JP. 01/13/1992

International Class

C22C 013/00

Abstract

A low melting point solder alloy comprising effective amounts of tin, silver and indium.

Other References

  • Rhines et al., Constitution of the System Indium-Tin, pp. 1-20, Paper Presented at the 28th Annual Convention of the American Society for Metals (1946)
  • Ludwick, Indium, pp. 21-151, The Indium Corporation of America (1959)
  • Manko, Solders and Soldering, pp. 115-123, McGraw Hill Book Company (2nd ed. 1979)
  • Federal Specification, Solder; Tin Alloy, Tin-Lead Alloy, and Alloy, QQ-S-571E (Interim Amendment 5 (ER) 28 Dec. 1989)
  • Stevens & White, Properties and Selection: Indium and Bismuth Metals Handbook, vol. 2 (10th ed. 1990)
  • Soldering of Electronic Products, Lead Industries Associatio (1991)
  • Anikeev et al., Improving the Brazeability of Steel with Siliconized Graphite by Alloying the Tin-Copper-Silver Brazing Alloy with Indium, 2390 Welding Production vol. 28 (1981) Mar., No. 3, Cambridge Great Britain, pp. 24-36
  • Andreeva et al., Solder for Soldering Components of Electrovacuum Devices, Chemical Abstracts, vol. 91, No. 14, Abstract No. 111344 (May 30, 1979)
  • Assembly Joining Handbook: 4.2.1 Low Melting Temperature Solders, the Institute for Interconnecting and Packaging Electronic Circuits, pp. 1-4 (Dec., 1983)
  • Federal Specifications, Solder; Tin Alloy, Tin-Lead Alloy, And Lead Alloy, QQ-S-571E (Interim Amendment 5 (ER) 28 Dec. 1989)
  • Ludwick, Indium, The Indium Corporation of America, pp. 21-151 (1950)
  • Manko, Solders and Soldering: 3-25 Intermediate-Temperature Indium Base Solders, pp. 115-123, McGraw Hill Book Company (2nd ed. 1979)
  • Rhines et al., Constitution of the System Indium-Tin, Paper Presented at the 28th Annual Convention of the American Society for Metals, pp. 1-20 (1946)
  • Soldering of Electronic Products, Lead Industries Association Inc., pp. 2-17 (1991)
  • Stevens & White, Properties and Selection: Indium and Bismuth, Metals Handbook vol. 2, pp. 750-757 (10th ed. 1990)
  • The Indium Corporation Of America, Indalloy Specialty Solders and Alloys, pp. 1-17
  • The Indium Corporation of America, Indalloy Fusible Alloys, pp. 1-5 (1988
PatentsPlus Images
Enhanced PDF formats
loading...
PatentsPlus: add to cart
PatentsPlus: add to cartSearch-enhanced full patent PDF image
$9.95more info
PatentsPlus: add to cart
PatentsPlus: add to cartIntelligent turbocharged patent PDFs with marked up images
$18.95more info
 
Sign InRegister
Username  
Password   
forgot password?