U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Passive cooling of enclosures using heat pipes

Patent 5579830 Issued on December 3, 1996. Estimated Expiration Date: Icon_subject November 28, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

2499736

Cooling system
Patent #: 4285027
Issued on: 08/18/1981
Inventor: Mori ,   et al.

Device for storing radioactive material in a building with a heat pipe inserted into the building wall
Patent #: 4582125
Issued on: 04/15/1986
Inventor: Baur ,   et al.

Thermal energy storage heat exchanger
Patent #: 4976308
Issued on: 12/11/1990
Inventor: Faghri

Controllable heat pipes for thermal energy transfer Patent #: 5159972
Issued on: 11/03/1992
Inventor: Gunnerson, et al.

Inventor

Assignee

Application

No. 563872 filed on 11/28/1995

US Classes:

165/104.27, With pressurizing means or degassifying means62/333, Primary and secondary dependent circuits165/104.21, Utilizing change of state165/104.33, Cooling electrical device165/135, WITH THERMAL OR ACOUSTICAL BLOCKER165/279Pressure and temperature responsive or control

Examiners

Primary: Hepperle, Stephen M.
Assistant: Atkinson, Christopher

Attorney, Agent or Firm

International Class

F28D 015/00

Abstract

A cooling system for passively cooling an enclosure incorporating at least one inclined heat pipe having an evaporator side extending within the enclosure and a condenser side extending outside the enclosure in contact with the ambient environment. A thermal storage device within the enclosure is configured having a first portion extending adjacent the evaporator side of the heat pipe and a second portion extending within, and generally concentric with, the evaporator side of the heat pipe. A solid-to-liquid phase change material is sealed within this thermal storage device such that this material changes to a liquid upon the absorption of heat. To further enhance the transfer of heat from within the enclosure to outside the enclosure, a series of fins can be added to the first portion of the thermal storage device as well as to the condenser side of the heat pipe. Additionally, a series of internal fins can be mounted to the second portion of the thermal storage device which would preferably be submerged in the working fluid contained within the evaporator side of the heat pipe.

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