ApplicationNo. 412101 filed on 03/28/1995
US Classes:165/296, Branched flow of heat exchange material165/101, Controls flow through parallel heating or cooling means165/104.32, With pressurizing means or degassifying means165/104.33, Cooling electrical device250/443.1, With heat transfer or temperature-indication means355/30, With temperature or foreign particle control378/34, Lithography378/35, Pattern mask378/208Object holder or support
ExaminersPrimary: Ford, John M.
Attorney, Agent or Firm
Foreign Patent References
International ClassF28D 015/00
Foreign Application Priority Data1988-10-03 JP
AbstractA temperature controlling device suitably usable in a semiconductor microcircuit manufacturing exposure apparatus exposes a semiconductor wafer to a mask to print a pattern of the mask on the wafer. The device includes a constant-temperature liquid medium supplying system for controlling temperature of a liquid at high precision, a distributing system for distributing the supplied liquid medium into plural flow passages, to supply the liquid medium to plural subjects of control such as, for example, a mask stage, a wafer stage and the like. The device further includes a plurality of temperature controls each being provided in corresponding one of the flow passages, for correction of any variance in temperature of the distributed liquid medium, resulting from pressure loss energies in the respective flow passages. Thus, temperatures of plural subjects of control can be controlled efficiently and with a simple structure.