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Method and apparatus for cooperated design

Patent 5572430 Issued on November 5, 1996. Estimated Expiration Date: Icon_subject November 5, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Inventors

Assignee

Application

No. 905888 filed on 06/29/1992

US Classes:

700/95Product assembly or manufacturing

Examiners

Primary: Envall, Roy N. Jr.
Assistant: Oakes, Brian C.

Foreign Patent References

  • 2-48774 JP. 02/12/1990

International Class

G06F 019/00

Foreign Application Priority Data

1991-07-03 JP

Abstract

In order to derive optimum design specifications based on total evaluation performed on a product as a whole instead of individual design items during a process of determining design specifications involving a plurality of design items, candidates for the product specifications are selected by controlling design parameters for each of the design items in an integrated manner, computing values of a plurality of evaluation items evaluating candidates for the design specifications and performing total evaluation on all the evaluation items based on their computed values through collaboration among a plurality of design sections altogether auto-correcting all relevant design parameters quickly and relaxing as well as reassessing design constraints for a design parameter.

Other References

  • Die Technologies, Edition No. 11, vol. 2, Chapter 2, published by Nikkan Kogyo Newspaper Company, Oct. 20, 1987, pp. 16-19. (Japanese)
  • Sugino, Kazuhiro, et al., "A System with Model Formulation Capabilities for Fluid Flow Analysis of Plastic Molds," The International Conference on Manufacturing Systems and Environment, The Japan Society of Mechanical Engineers, Tokyo, Japan, May 28-Jun. 1, 1990, pp. 1-6. (English)
  • Saeki, Junichi, et al. "Flow Analysis of an Epoxy Compound for Low-Pressure Transfer Molding in a Circular Cross-Sectional Channel," JSME International Journal, Series II, vol. 33, No. 3, 1990, pp. 486-493. (English)
  • Kitano, Makoto, et al. "Analysis of Package Cracking During Reflow Soldering Process," Proceedings of the 26th International Reliability Physics Symposium, IEEE/IRPS, 1988, pp. 90-95. (English
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