Integrated circuit packages with heat dissipation for high current load
Patent 5572070 Issued on November 5, 1996. Estimated Expiration Date: 
February 6, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
February 6, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesHeat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate Package for semiconductor elements having thermal dissipation means Patent #: 5455457 InventorAssigneeApplicationNo. 383511 filed on 02/06/1995US Classes:257/713, For integrated circuit257/675, With heat sink means257/704, Cap or lid257/706, With heat sink257/707, Directly attached to semiconductor device257/E23.087, Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (EPO)257/E23.107Organic materials with or without thermo-conductive filler (EPO)ExaminersPrimary: Crane, Sara W.Assistant: Wallace, Valencia Martin Attorney, Agent or FirmInternational ClassesH01L 023/10H01L 023/12 H01L 023/34 AbstractAn integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contains a thermally conductive filler material. With the lid in place over the die and substrate board, the package is heated to cause the resin to flow and establish contact with the die. Further heating causes curing of the resin and a permanent thermal bridge between the die and the lid. | |
