Attaching an electronic circuit to a substrate
March 11, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesIdentification card Sculptured stripline interface conductor Stolen article detection tag sheet, and method for manufacturing the same Flexible cicuit substrate with electroconductive adhesive layer and its production Process for fabricating a sculptured stripling interface conductor Planar antenna Thin electronic device having an integrated circuit chip and a power battery and a method for producing same Personal data card fabricated from a polymer thick-film circuit Porous substrate and conductive ink filled vias for printed circuits Electronic circuit device Patent #: 5386214 InventorsAssigneeApplicationNo. 209046 filed on 03/11/1994US Classes:29/600, Antenna or wave energy "plumbing" making29/840, By metal fusion228/180.22, Lead-less (or "bumped") device257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E21.516, Involving automation techniques using film carriers (EPO)257/E23.178, Chips being integrally enclosed by interconnect and support structures (EPO)428/901PRINTED CIRCUITExaminersPrimary: Arbes, Carl J.Attorney, Agent or FirmForeign Patent References
International ClassH01P 011/00Foreign Application Priority Data1993-03-11 ZAAbstractIntegrated circuits such as transponders are attached to a substrate such as cardboard packaging material by adhering an integrated circuit in the substrate, applying a patch antenna to the substrate and the integrated circuit, and applying a sealing layer over the integrated circuit and at least a portion of the antenna. In variations of the method, an indentation may be formed in the substrate into which the integrated circuit is placed. The patch antenna may be screen printed onto the substrate and the integrated circuit, using conductive ink, or may be a metallic foil which is applied to the substrate and the integrated circuit. Where the integrated circuit is a transponder, it can be programmed with an identification code, either before or after being attached to the substrate. | |
