U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid

Patent 5563768 Issued on October 8, 1996. Estimated Expiration Date: Icon_subject August 31, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Integral electric module and assembly jet cooling system
Patent #: 4399484
Issued on: 08/16/1983
Inventor: Mayer

Cooling module for electronic equipment
Patent #: 4648007
Issued on: 03/03/1987
Inventor: Garner

Apparatus for cooling integrated circuit chips with forced coolant jet
Patent #: 4750086
Issued on: 06/07/1988
Inventor: Mittal

Cooling system for an electronic circuit device
Patent #: 4783721
Issued on: 11/08/1988
Inventor: Yamamoto ,   et al.

Method and apparatus for adjustably mounting a heat exchanger for an electronic component
Patent #: 4882654
Issued on: 11/21/1989
Inventor: Nelson, et al.

Cooling system and method for electronic circuit devices
Patent #: 4897762
Issued on: 01/30/1990
Inventor: Daikoku, et al.

Isothermal multi-passage cooler
Patent #: 5005640
Issued on: 04/09/1991
Inventor: Lapinski, et al.

Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
Patent #: 5077601
Issued on: 12/31/1991
Inventor: Hatada, et al.

Circuit pack cooling using turbulators
Patent #: 5103374
Issued on: 04/07/1992
Inventor: Azar

Apparatus for cooling integrated circuit chips
Patent #: 5239200
Issued on: 08/24/1993
Inventor: Messina, et al.

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Inventor

Assignee

Application

No. 524020 filed on 08/31/1995

US Classes:

361/695, Fan or blower165/80.3, Air cooled, including fins257/722, With fins257/E23.099By flowing gases, e.g., air (EPO)

Examiners

Primary: Thompson, Gregory D.

Attorney, Agent or Firm

Foreign Patent References

  • 0268817 DE 06/13/1989

International Class

H05K 007/20

Abstract

A method of cooling a heat source includes the steps of (1) positioning a thermally conductive base in contact with the heat source, the base having a plurality of fins which define a plurality of channels, (2) generating an initial flow of fluid, (3) positioning a baffle in the path of the initial flow of fluid so as to create a primary flow of fluid and a secondary flow of fluid, (4) directing the primary flow of fluid against the plurality of fins so as to form a quantity of spent fluid which is advanced into the channels, (5) directing the secondary flow of fluid into the plurality of channels so as to force the quantity of spent fluid out of the plurality of channels, and (6) repositioning the baffle from a first position to a second position to change the magnitude of the primary flow of fluid. An apparatus for cooling a heat source which splits an initial flow of fluid into a primary flow of fluid and a secondary flow of fluid is also disclosed.

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