Stencil perforating method, stencil perforating system, and stencil printing machine
Patent 5559546 Issued on September 24, 1996. Estimated Expiration Date: 
August 16, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 16, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesStencil duplicator capable of immediate restart Stencil master plate making printing device Method and apparatus for making a mimeographic printing plate Thermal stenciling device Patent #: 5384585 InventorAssigneeApplicationNo. 291549 filed on 08/16/1994US Classes:347/200, Specific resistance recording element type347/171THERMAL MARKING APPARATUS OR PROCESSESExaminersPrimary: Tran, HuanAttorney, Agent or FirmForeign Patent References
International ClassB41J 002/335Foreign Application Priority Data1993-12-17 JPAbstractA heat sensitive stencil is brought into contact with a thermal head having a plurality of heating resistors arranged in a row, is moved in a sub-scanning direction orthogonal to a direction in which the heating resistors are arranged, and is perforated in the dot matrix shape with selectively heated heating resistors. The heat sensitive stencil is made substantially only of a thermoplastic resin film. A width of a non-perforated portion of the heat sensitive stencil between two adjacent perforations is 20% or more of a pitch between two adjacent heating resistors in the main scanning direction. | |
