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US Patent 5554064 - Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US Patent Issued on September 10, 1996
Estimated Patent Expiration Date:
September 10, 2013Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
Estimated Patent Expiration Date:
September 10, 2013Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractA method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate. | InventorsApplicationNo. 103412 filed on 08/06/1993US Classes:451/41, Glass or stone abrading451/60, Abradant supplying451/446, Abradant supplying451/505Hydraulically actuatedField of Search451/41, Glass or stone abrading451/60, Abradant supplying451/446, Abradant supplying451/166, Compound rectilinear motion451/173, Rotary work holder451/162, Reciprocating tool451/270, Orbital451/287, Planar surface abrading451/288, Having pressure plate451/289, Having vacuum or adhesive securing means451/505, Hydraulically actuated451/53With critical temperature modification or control of work or abradantExaminersPrimary: Rose, Robert A.Attorney, Agent or FirmUS Patent References4831784, Polishing apparatus for end faces of optical fibersIssued on: 05/23/1989 Inventor: Takahashi5185966, Methods of and apparatus for polishing an article Issued on: 02/16/1993 Inventor: Mock, Jr., et al.5216843, Polishing pad conditioning apparatus for wafer planarization process Issued on: 06/08/1993 Inventor: Breivogel, et al.5230184, Distributed polishing head Issued on: 07/27/1993 Inventor: Bukhman5232875, Method and apparatus for improving planarity of chemical-mechanical planarization operations Issued on: 08/03/1993 Inventor: Tuttle, et al.5351445Apparatus for grinding end faces of ferrules together with optical fibers each firmly received in ferrules Issued on: 10/04/1994 Inventor: Takahashi Foreign Patent References
International ClassesB24B 029/00B24B 007/22 |
