Method for directly joining a chip to a heat sink
June 5, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesHeat transfer mechanism for integrated circuit package Semiconductor package with improved conduction cooling structure Restorable backbond for LSI chips using liquid metal coated dendrites Electronic component and adhesive strip combination, and method of attachment of component to a substrate Method of mounting electric part onto a substrate Method of making a dimensionally stable semiconductor device Package having a heat sink suitable for a ceramic substrate Electronic package with improved heat sink Aluminum-silicon alloy heatsink for semiconductor devices High power, pluggable tape automated bonding package InventorsApplicationNo. 461814 filed on 06/05/1995US Classes:29/840, By metal fusion174/16.3, With heat sink257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E23.069, Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)257/E23.087, Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (EPO)257/E23.104, Characterized by shape of housing (EPO)438/122, Possessing thermal dissipation structure (i.e., heat sink)438/127EncapsulatingExaminersPrimary: Arbes, Carl J.Attorney, Agent or FirmInternational ClassH05K 003/34AbstractThe present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink.Other References
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