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US Patent 5530604 - Electrical connection and slider-suspension assembly having an improved electrical connection

US Patent Issued on June 25, 1996
Estimated Patent Expiration Date: Icon_subject May 19, 2014Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
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Abstract

A method for the fabrication of a data recording disk file slider-suspension assembly, the slider being of the type having an air bearing surface, a back side opposite the air bearing surface and a trailing edge having a read or write transducer formed as a thin film thereon with electrical leads formed solely on the trailing edge and terminating adjacent the slider back side at termination pads, and a suspension having etched conductive lead structures and conductive contact pads connected to the lead structures. The method comprising the steps of forming a solder bump on each of the termination pads and each of the contact pads, wherein one or more solder bumps are selectively flattened, mechanically attaching the back side of the slider to the suspension such that the termination pads are properly aligned with the contact pads, and heating the solder bumps so as to reflow the termination pad and contact pad bumps such that they electrically connect, wherein a selectively flattened bump extends along an axis defined by a point on one pad and a point on another pad when heated to make contact with another bump.

Other References

  • "Combination Suspension-Lead Cable for a Multi-Gap Read/Write Head", IBM Technical Disclosure Bulletin, vol. 22, No. 4, New York, U.S., Sep., 1979, pp. 1602-1603
  • "Method for Slider Attachment and Head Termination to a Suspension in a Disk File", IBM Technical Disclosure Bulletin, vol. 36, No. 02, New York, U.S., Feb., 1993, p. 37

Inventor

Application

No. 246052 filed on 05/19/1994

US Classes:

360/234.5Electrical attachment of slider/head

Field of Search

360/97.01, Disk record360/97.02Environmental control (e.g., air filter, temperature control)

Examiners

Primary: Heinz, A. J.

Attorney, Agent or Firm

US Patent References

4752027, Method and apparatus for solder bumping of printed circuit boards
Issued on: 06/21/1988
Inventor: Gschwend
4761699, Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file
Issued on: 08/02/1988
Inventor: Ainslie ,   et al.
5167361, Method and apparatus for two sided solder cladded surface mounted printed circuit boards
Issued on: 12/01/1992
Inventor: Liebman, et al.
5415944Solder clad substrate
Issued on: 05/16/1995
Inventor: Kazem-Goudarzi, et al.

Foreign Patent References

  • 56-111234 JP. 09/19/1981
  • 1028931 JP. 01/19/1989

International Class

G11B 005/48

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