Electrical connection and slider-suspension assembly having an improved electrical connection
Patent 5530604 Issued on June 25, 1996. Estimated Expiration Date: 
May 19, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 19, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod and apparatus for solder bumping of printed circuit boards Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file Method and apparatus for two sided solder cladded surface mounted printed circuit boards Solder clad substrate Patent #: 5415944 InventorApplicationNo. 246052 filed on 05/19/1994US Classes:360/234.5Electrical attachment of slider/headExaminersPrimary: Heinz, A. J.Attorney, Agent or FirmForeign Patent References
International ClassG11B 005/48AbstractA method for the fabrication of a data recording disk file slider-suspension assembly, the slider being of the type having an air bearing surface, a back side opposite the air bearing surface and a trailing edge having a read or write transducer formed as a thin film thereon with electrical leads formed solely on the trailing edge and terminating adjacent the slider back side at termination pads, and a suspension having etched conductive lead structures and conductive contact pads connected to the lead structures. The method comprising the steps of forming a solder bump on each of the termination pads and each of the contact pads, wherein one or more solder bumps are selectively flattened, mechanically attaching the back side of the slider to the suspension such that the termination pads are properly aligned with the contact pads, and heating the solder bumps so as to reflow the termination pad and contact pad bumps such that they electrically connect, wherein a selectively flattened bump extends along an axis defined by a point on one pad and a point on another pad when heated to make contact with another bump.Other References
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