Patent ReferencesPosition detecting system Surface displacement sensor with opening angle control Non-contact sensor with particular utility for measurement of road profile Apparatus for detecting the level of an object surface Optically scanning displacement sensor with linearity correction means Surface position sensor Optical system for detecting three-dimensional shape Device for detecting the position of a surface Scanning probe microscope with slant detection and compensation Height measurement apparatus using laser light beam Patent #: 5272517 InventorsAssigneeApplicationNo. 361131 filed on 12/21/1994US Classes:356/623, Triangulation250/559.31With triangulationExaminersPrimary: Evans, F. L.Attorney, Agent or FirmInternational ClassG01B 011/14AbstractThe position detector has a sensitivity characteristic graded along a direction transverse to the surface, so that the output of the position detector is used to determine a height of the surface. A surface height detection and positioning device for use in a surface inspection system. An incident beam of light impinges obliquely upon the surface, and a position detector is disposed to receive specularly reflected light, producing a plurality of electrical signals, with a mechanical window, defining an aperture, placed in front of the detector. The aperture's width, along the scan direction, is of sufficient size so as to create a train of signals from each of the plurality of electrical signals, having a frequency equal to the scan frequency. These electrical signals carry information responsive to both the position of reflected beam impinging on the detector and the beam's intensity and are, in turn, related to a height of the surface. To abrogate information responsive to intensity variations at the position sensitive detector, an electronic circuit is employed which determines the sum and the difference of the plurality of signals relating to wafer height and beam intensity, producing a summed signal and a difference signal respectively. The difference signal is then divided by the summed signal, thereby producing a normalized signal which represents the height of the wafer surface without regards to these reflected beam intensity variations. These signals are synchronized to the scan frequency which facilitates removing unwanted signals resulting from thermal drifts and ambient light. | |