Semiconductor chip having a dam to prevent contamination of photosensitive structures thereon
April 24, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of fabricating multilayer structures with nonplanar surfaces Producing integrated circuit chips with reduced stress effects Method of encapsulating a sensor device using capillary action and the device so encapsulated Method of making a post molded cavity package with internal dam bar for integrated circuit Color filter Technique of increasing bond pad density on a semiconductor die Method for forming plastic molded package with heat sink for integrated circuit devices Flexible substrate with projections to block resin flow Patent #: 5422163 InventorsAssigneeApplicationNo. 427518 filed on 04/24/1995US Classes:257/432, With optical element250/227.23, With spectral frequency/wavelength discrimination257/443, Matrix or array (e.g., single line arrays)257/459, With particular contact geometry (e.g., ring or grid, or bonding pad arrangement)257/667, With dam or vent for encapsulant257/E23.129Partial encapsulation or coating (EPO)ExaminersPrimary: Brown, Peter R.Attorney, Agent or FirmForeign Patent References
International ClassesH01L 031/022.4H01L 031/023.2 AbstractIn dicing of semiconductor chips from a wafer and mounting of the chips in an apparatus, techniques ensure the integrity of bonding pads and wire bonds in the dicing of individual chips and the connection of wire bonds to the chips. The wire bonds in the undiced chips are each connected to a probe pad disposed in an inter-chip area on the wafer, and this probe pad is used to accept probe pins which may otherwise damage the bonding pads on the chips themselves. In the dicing step, the probe pads are obliterated by the cutting blade. A polyimide dam disposes adjacent the bonding pads restricts the migration of liquid encapsulant securing the wire bonds to the bonding pads.Field of SearchPlural photosensitive image detecting element arraysPlural photosensitive nonimage detecting elements Special photocell or electron tube circuits Special photocell Color (e.g., filter or spectroscope) With spectral frequency/wavelength discrimination With housing or contact structure Light With optical element With housing or encapsulation Matrix or array (e.g., single line arrays) With particular electrode configuration With particular contact geometry (e.g., ring or grid, or bonding pad arrangement) Configuration or pattern of bonds With dam or vent for encapsulant | |
