Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
June 28, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3533896 Method of manufacturing semiconductor devices using laser beam cutting Process for the production of mutually electrically insulated monocrystalline silicon islands using laser recrystallization Method for separating monolithically produced laser diodes Process for the separation of monolithic LED chip arrangements generated on a semiconductor substrate wafer Method of assembling stacks of integrated circuit dies Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same Method of obtaining semiconductor chips Semiconductor device package with dies mounted on both sides of the central pad of a metal frame Inventors
ApplicationNo. 267878 filed on 06/28/1994US Classes:29/827, Beam lead frame or beam lead device257/E23.052, Assembly of semiconductor devices on lead frame (EPO)438/107, Assembly of plural semiconductive substrates each possessing electrical device438/123Lead frameExaminersPrimary: Picardat, Kevin M.Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/60AbstractA method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.Field of SearchLEAD FRAMEWith structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED) With dam or vent for encapsulant For plural devices With discrete components With electrical isolation means Devices held in place by clamping Device held in place by clamping | |
