Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips
Patent 5523628 Issued on June 4, 1996. Estimated Expiration Date: 
August 5, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 5, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3811186 Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate Substrate for packaging a semiconductor device Provision of substrate pillars to maintain chip standoff Patent #: 5220200 InventorsApplicationNo. 286734 filed on 08/05/1994US Classes:257/777, Chip mounted on chip257/778, Flip chip257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.194Protection against mechanical damage (EPO)ExaminersPrimary: Hille, RolfAssistant: Hardy, David B. Attorney, Agent or FirmForeign Patent References
International ClassH01L 023/10AbstractA method and apparatus for protecting metal bumped chips during processing and for providing mechanical support to interconnected chips. A protective adhesive stop is affixed to a metal bumped chip so that the height of the stop is at least as high as the metal bump. The stop protects the metal bump during routine handling. When the chip is interconnected to another bumped chip by cold welding their respective metal bumps, the stop contacts the face of the second chip and provides mechanical support. The stop is preferably a thermoplastic that is heated to adhere it to the second chip. The addition of the protective stop facilitates automated processing of metal bumped chips, and provides stronger, faster, and lower power chips. | |
