Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
Substrate for packaging a semiconductor device
Provision of substrate pillars to maintain chip standoff Patent #: 5220200
ApplicationNo. 286734 filed on 08/05/1994
US Classes:257/777, Chip mounted on chip257/778, Flip chip257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.194Protection against mechanical damage (EPO)
ExaminersPrimary: Hille, Rolf
Assistant: Hardy, David B.
Attorney, Agent or Firm
Foreign Patent References
International ClassH01L 023/10
AbstractA method and apparatus for protecting metal bumped chips during processing and for providing mechanical support to interconnected chips. A protective adhesive stop is affixed to a metal bumped chip so that the height of the stop is at least as high as the metal bump. The stop protects the metal bump during routine handling. When the chip is interconnected to another bumped chip by cold welding their respective metal bumps, the stop contacts the face of the second chip and provides mechanical support. The stop is preferably a thermoplastic that is heated to adhere it to the second chip. The addition of the protective stop facilitates automated processing of metal bumped chips, and provides stronger, faster, and lower power chips.