Device for conditioning polishing pads
Patent 5486131 Issued on January 23, 1996. Estimated Expiration Date: 
January 4, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 4, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesWet sanding device Method for machining workpieces of brittle hard material into wafers Dressing fixture Surface grinding machine and method Method for conditioning the surface of a polishing pad Polishing pad conditioning apparatus for wafer planarization process Patent #: 5216843 InventorsAssigneeApplicationNo. 177156 filed on 01/04/1994US Classes:451/56, With tool treating or forming451/159, Oscillating451/173, Rotary work holder451/285, Rotary work holder451/413, Work rotating451/443, Dressing451/444, Tool cleaner451/548Rotary diskExaminersPrimary: Kisliuk, Bruce M.Assistant: Morgan, Eileen P. Attorney, Agent or FirmInternational ClassesB24B 001/005 D 236 240 T 237 R 325 AbstractA device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.Other References
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