Patent ReferencesMethod of manufacture for self-aligned floating gate memory cell Semiconductor memory device Semiconductor memory device MOS static ram with capacitively loaded gates to prevent alpha soft errors MOS/CMOS memory cell Random access memory cell resistant to inadvertant change of state due to charged particles Self-aligned sidewall gate IGFET Stacked static random access memory cell having capacitor High impendance-coupled CMOS SRAM for improved single event immunity Static random access memory with reduced soft error rate InventorsAssigneeApplicationNo. 278465 filed on 07/21/1994US Classes:365/154, Flip-flop (electrical)257/277, With capacitive or inductive elements257/303, Stacked capacitor257/903, FET CONFIGURATION ADAPTED FOR USE AS STATIC MEMORY CELL257/E21.661, Static random access memory structures (SRAM) (EPO)365/149CapacitorsExaminersPrimary: Nelms, David C.Assistant: Niranjan, F. Attorney, Agent or FirmForeign Patent References
International ClassG11C 011/00AbstractThe present invention includes an integrated circuit having a self-aligned contact that makes contact to both a region within the substrate and a capacitor plate of a capacitor that is adjacent to the doped region. The present invention also includes a static-random-access memory cell with a capacitor having a first plate and a second plate. The first plate includes a first plate section of a gate electrode of a transistor, and the second plate includes a first conductive member that is substantially coincident with the first plate section. The second plate may be formed over a gate electrode of a latch transistor or over a word line. The disclosure includes methods of forming the integrated circuit and the static-random-access memory cell.Other References
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