Method of making a through-hole connector
Reinforced dielectric sheet
Printed circuit substrate
Manufacture of printed circuit boards
Electrically conductive article
Flexible sheet reinforced with poly(aromatic amide) non-woven fabric and use thereof
Circuit board fabrication Patent #: 5117069
ApplicationNo. 258383 filed on 06/10/1994
US Classes:29/852, By forming conductive walled aperture in base29/829, On flat or curved insulated base, e.g., printed circuit, etc.29/830, Assembling bases174/264, Voidless (e.g., solid)428/901PRINTED CIRCUIT
ExaminersPrimary: Arbes, Carl J.
Attorney, Agent or Firm
Foreign Patent References
International ClassH01K 003/10
Foreign Application Priority Data1992-05-06 JP
AbstractA method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive shrinkage, filling electro-conductive paste into the through-holes, separating the cover films from the porous raw material filled with the electro-conductive paste in its through-holes, applying metal foils onto the surfaces of the porous raw material from which the cover films have been separated, and compressing the porous raw material applied with the metal foils through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.