Patent ReferencesI2 L ring oscillator and method of fabrication Method and apparatus for measuring the speed of an integrated circuit device Circuit arrangement for testing integrated circuit components Wafer-level burn-in testing of integrated circuits Tester for measuring signal propagation delay through electronic components On-chip integrated circuit speed selection Patent #: 5099196 InventorsApplicationNo. 096643 filed on 07/23/1993US Classes:324/763, DUT including test circuit324/158.1, MISCELLANEOUS324/765, Test of semiconductor device714/733Built-in testing circuit (BILBO)ExaminersPrimary: Karlsen, Ernest F.Attorney, Agent or FirmForeign Patent References
International ClassG01R 031/28AbstractA test circuit is provided for an integrated circuit device, whereby an oscillator is provided on-chip and is activated by a test circuit. The test circuit provides an ability to test the devices while still on the wafer and facilitates burning in the wafer prior to singulating the parts, since it is not necessary to separately establish electrical connections at contact points on the individual integrated circuit devices. The oscillator may be adjusted in speed so that further tests may be effected by changing a test speed through the test circuit. Response of the DUT at different operating speeds is determined by the adjustment of the oscillator speed so that a timing signal used for the testing may be varied. | |