Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability

Patent 5456081 Issued on October 10, 1995. Estimated Expiration Date:

April 1, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

2815472

2965819

2984077

2994203

Chip mounting device
Patent #: 4664309
Issued on: 05/12/1987
Inventor: Allen , et al.

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Patent #: 4770242
Issued on: 09/13/1988
Inventor: Daikoku , et al.

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Inventor: Hamburgen

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Patent #: 5232516
Issued on: 08/03/1993
Inventor: Hed

Electronic unit Patent #: 5276584
Issued on: 01/04/1994
Inventor: Collins, et al.

Inventors

Application

No. 222150 filed on 04/01/1994

US Classes:

62/3.7, Including specific circuitry or heat exchanger material62/259.2, With electrical component cooling136/204, Including additional heat exchange means165/80.2, Electrical component165/185, HEAT TRANSMITTER257/E23.082Cooling arrangements using Peltier effect (EPO)

Examiners

Primary: Bennett, Henry
Assistant: Doerrler, William C.

Attorney, Agent or Firm

Cutter; Lawrence D.

International Class

H01L 035/28

Abstract

A configuration of solid state thermoelectric heat transfer or removal elements is provided to enhance the rate and amount of heat removal from electrical and electronic circuit devices. By rotating the thermoelectric heat transfer modules ninety degrees and by disposing them between the interdigitated fingers of a cold plate and a heat transfer plate possessing fins, improved thermal transfer is produced without the necessity of liquid coolants or moving part cooling devices. Accordingly, a method and apparatus is provided for enhancing heat transfer using thermoelectric modules. One embodiment of the present invention is particularly seen to be easy to manufacture. Additionally, this embodiment also possesses desirable heat transfer characteristics in terms of the cross sections of thermally conductive components.