Scalable fuse link element
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Method of manufacturing field-emitter Patent #: 5358909
ApplicationNo. 217410 filed on 03/24/1994
US Classes:438/479, On insulating substrate or layer216/11, FORMING OR TREATING AN ARTICLE WHOSE FINAL CONFIGURATION HAS A PROJECTION257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.06, Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (EPO)438/619, Air bridge structure438/970SPECIFIED ETCH STOP MATERIAL
ExaminersPrimary: Hearn, Brian E.
Assistant: Nguyen, Tan T.
Attorney, Agent or Firm
International ClassH01L 021/60
AbstractA device for making temporary or permanent electrical connections to circuit pads of an integrated circuit is made with conventional semiconductor fabrication processes. The device has a supporting substrate from which project a plurality of insertion structures that are in mating alignment with corresponding circuit pads of the integrated circuit. Each insertion structure is metallized to make electrical contact with the corresponding circuit pad. The electrical contacts may be temporary or permanent depending upon the choice of metallization and the pressure applied to the contacting surfaces. The insertion structure devices have particular application for functional testing, electrical burn-in and packaging of an integrated circuit either as a full wafer or as an individual die.