Cooling of semiconductor power modules by flushing with dielectric liquid
November 2, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesApparatus for vapor-cooling a semiconductor Circuit package cooling technique with liquid film spreading downward across package surface without separation Liquid cooled high density packaging for high speed circuits Semiconductor cooling apparatus and cooling method thereof Directly cooled circuit board for an electronic power circuit Liquid impingement cooling module for semiconductor devices Patent #: 5270572 InventorsApplicationNo. 146686 filed on 11/02/1993US Classes:257/714, Liquid coolant257/715, Boiling (evaporative) liquid257/E23.098, By flowing liquids (EPO)361/699, Liquid361/719, Circuit board mounted361/720For printed circuit boardExaminersPrimary: Limanek, Robert P.Assistant: Ostrowski, David Attorney, Agent or FirmForeign Patent References
International ClassesH01L 025/04H01L 023/02 AbstractSemiconductor dies (30-40) are mounted on a printed wiring board (28) to be vertically oriented. They are enclosed in a housing (12) which is supplied with an upwardly flowing dielectric liquid coolant. Nozzles (18,20) direct the dielectric liquid coolant to flow upward over the dies and printed wiring board. Heat is directly extracted from the dies. | |
