Wedge wire bonding tool tip
Patent 5445306 Issued on August 29, 1995. Estimated Expiration Date: 
May 31, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 31, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3623649 3627192 3690538 3718272 3863827 Multiface wire bonding method and tool Bonding tool 4030657 Ultrasonic wire bonding tool Wedge bonding tool InventorAssigneeApplicationNo. 251500 filed on 05/31/1994US Classes:228/1.1, MEANS TO APPLY VIBRATORY SOLID-STATE BONDING ENERGY (E.G., ULTRASONIC, ETC.) TO WORK228/4.5Wire lead bonderExaminersPrimary: Heinrich, Samuel M.Attorney, Agent or FirmInternational ClassesH01L 021/607B23K 020/10 AbstractA wedge bond tool tip (20, 30, 50, 56) for bonding electronic interconnects to bonding pads of a semiconductor device enables fine-pitch non-orthogonal wire bonding. The tool tip (20, 30, 50, 56) has an overall width and a front face (12', 52) that has a reduced area which is narrower than the overall width. The reduction in the front face is accomplished through either chamfering or rounding of the corners to reduce the contact distance (42 and 44) between the wedge tool and a previously made adjacent bond. This design maintains the structural integrity needed to produce acceptable wedge bonds.Other References
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