Multiface wire bonding method and tool
Ultrasonic wire bonding tool
Wedge bonding tool
ApplicationNo. 251500 filed on 05/31/1994
US Classes:228/1.1, MEANS TO APPLY VIBRATORY SOLID-STATE BONDING ENERGY (E.G., ULTRASONIC, ETC.) TO WORK228/4.5Wire lead bonder
ExaminersPrimary: Heinrich, Samuel M.
Attorney, Agent or Firm
International ClassesH01L 021/607
AbstractA wedge bond tool tip (20, 30, 50, 56) for bonding electronic interconnects to bonding pads of a semiconductor device enables fine-pitch non-orthogonal wire bonding. The tool tip (20, 30, 50, 56) has an overall width and a front face (12', 52) that has a reduced area which is narrower than the overall width. The reduction in the front face is accomplished through either chamfering or rounding of the corners to reduce the contact distance (42 and 44) between the wedge tool and a previously made adjacent bond. This design maintains the structural integrity needed to produce acceptable wedge bonds.