Hot melt adhesive
Patent 5441999 Issued on August 15, 1995. Estimated Expiration Date: 
October 15, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
October 15, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3644267 3900694 Polyethylene-based bookbinding hot-melt adhesive Adhesive compositions Hot-melt adhesive composition Hot melt adhesive composition for book lining Patent #: 4660858 InventorsAssigneeApplicationNo. 137599 filed on 10/15/1993US Classes:524/271, Two or more solid polymers or at least one solid polymer and at least one specified intermediate condensation product524/489Wax having melting point above 120 deg. F (49 deg. C)ExaminersPrimary: Payer, Hwei-SiuAttorney, Agent or FirmInternational ClassC08L 091/00AbstractThe foregoing and other objects and advantages of the present invention are accomplished by a hot melt adhesive comprising a blend of a low molecular weight polyolefin, olefin-carboxylic acid graft polymer or olefin-maleic anhydride graft polymer or blend thereof; a propylene-ethylene copolymer or propylene-ethylene-butene terpolymer; and a tackifying resin or blend of tackifying resins. The blend can include an antioxidant or blends of antioxidants, a high molecular weight or functionalized polyolefin or a copolymer or terpolymer of a vinyl monomer (e.g., ethylene/vinyl acetate).Field of SearchBindingPROCESS Of adhesive binding With a nonreactive material Two or more solid polymers or at least one solid polymer and at least one specified intermediate condensation product Wax having melting point above 120 deg. F (49 deg. C) Metal atom other than as silicate DNRM Monoethylenically unsaturated | |
