Apparatus for forming a metal wiring pattern of semiconductor devices
Patent 5437777 Issued on August 1, 1995. Estimated Expiration Date: December 28, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
A plating apparatus for forming a wiring pattern on a surface of a semiconductor wafer by causing a plating liquid into contact with the surface of the semiconductor wafer, comprises a storage tank storing and heating a plating liquid, a plating tank provided adjacent to the storage tank and having an opening formed in a wall at the side opposite to the side adjacent to the storage tank. The plating tank is supplied with the plating liquid from the storage tank, and the opening is configured to bring the surface of the semiconductor wafer into contact with the treatment liquid within the treatment tank. A holding mechanism is provided for holding the semiconductor wafer vertically and pushing the surface of the semiconductor wafer to the opening. With this arrangement, it is possible to prevent the unevenness of the plating which would otherwise have been caused by the bubbles generated in the process of the plating.
December 28, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
