Interconnect structure having improved metallization

Patent 5436412 Issued on July 25, 1995. Estimated Expiration Date:

August 3, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Method of forming an integrated circuit assembly
Patent #: 3959874
Issued on: 06/01/1976
Inventor: Coucoulas

Substrate for interconnecting electronic integrated circuit components having a repair arrangement enabling modification of connections to a mounted chip device
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4751349

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Inventors

Application

No. 102027 filed on 08/03/1993

US Classes:

174/265, Preform in hole174/257, Conducting (e.g., ink)174/261, With particular conductive connection (e.g., crossover)174/262, Feedthrough257/E23.069, Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)257/E23.072, Characterized by materials (EPO)257/E23.173Multilayer substrates (EPO)

Examiners

Primary: Picard, Leo P.
Assistant: Thomas, L.

Attorney, Agent or Firm

Blecker; Ira David

Foreign Patent References

0380289A3 EP 01/21/1990
0504411A1 EP 09/21/1991
0536418A1 EP 04/21/1992
60138948 JP 12/21/1983
WO92/20100 WO 07/21/1991

International Class

H06K 001/02

Abstract

An electrical interconnect structure for connecting a substrate to the next level of packaging or to a semiconductor device. The interconnect structure includes at least two layers of polymeric material, one of the layers having a capture pad and the second of the layers having a bonding pad electrically connected to the capture pad. The bonding pad and the second layer of polymeric material are at the same height so that the bonding pad is level with the second layer of polymeric material. Finally, there is a cap of electrically conducting metallization on the bonding pad and extending beyond the second layer of polymeric material. The cap is of a different composition than the bonding pad.

Other References

IBM Research Disclosure, "Combination Process for Final Metal Lines and Metal Terminals", Disclosed anonymously; Oct. 1992, No. 342, p. 753
IEEE, "Production of MCP Chip Carriers", M. E. Williams, 0569-5503/90-0000-0408 May, 199