Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards
July 27, 2012. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesContinuous solder paste dispenser Method and apparatus for dispensing solder paste Method of soldering joints by moving them through a target area on which a stream of hot gas is focused Method of manufacturing a seal Method for connecting a leadless chip carrier to a substrate Solder paste stencil printer 5118027 Method for controlling solder printer Patent #: 5232736 InventorsAssigneeApplicationNo. 918741 filed on 07/27/1992US Classes:427/98.4, Nonuniform or patterned coating427/282Mask or stencil utilizedExaminersPrimary: Beck, ShriveAssistant: Dang, Vi Duong Attorney, Agent or FirmForeign Patent References
International ClassB05D 001/00AbstractA single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).Field of SearchMask or stencil utilized | |
