Multi-chip module having thermal contacts
November 15, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of making an electronic device using an uniaxial conductive adhesive Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom Multichip integrated circuit packaging configuration and method Advanced polymers on metal printed wiring board Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive Liquid jet recording head with bump connector wiring Patent #: 5227812 InventorsApplicationNo. 151871 filed on 11/15/1993US Classes:361/719, Circuit board mounted174/261, With particular conductive connection (e.g., crossover)257/700, Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package)257/E23.072, Characterized by materials (EPO)257/E23.077, Materials of insulating layers or coatings (EPO)257/E23.105, Wire-like or pin-like cooling fins or heat sinks (EPO)257/E23.169, Interconnection structure between plurality of semiconductor chips being formed on or in insulating substrates (EPO)361/705, By specific coating361/795Plural dielectric layersExaminersPrimary: Tolin, Gerald P.Attorney, Agent or FirmInternational ClassH05K 007/20AbstractA multi-chip module (MCM) having semiconductor chips on a top surface of multi-layered interconnection circuits formed on a planar surface of a substrate including: (a) multi-layered interconnection circuits comprising alternatively laminated interconnection layers with insulating layers, and thermal contacts, each of the thermal contacts comprising successively laminated interconnection layers on a bottom and on side-walls of a vertical hole penetrating a plurality of the insulating layers, and a thermal conductor filling the vertical hole on the successively laminated interconnection layers, and (b) a plurality of the semiconductor chips attached to the thermal conductor. In a preferred embodiment, a V-shaped vertical hole is formed in the insulating layers of polyimide for a thermal contact, copper films are successively laminated thereon, unpatterned copper and gold films are deposited thereon, and the entire surface of the metal film including the hole is coated by a silver-powder containing epoxy film, to which semiconductor chips are adhered.Field of SearchThermal conductionThrough support means By specific coating Thermally and electrically conductive Electrically insulating thermally conductive For module For integrated circuit Circuit board mounted Flexible board Connection of components to board With mounting pad Shaped lead on board Flexible connecting lead Cross-connected Having semiconductive device Plural contiguous boards Plural dielectric layers With cooling means Convertible shape (e.g., flexible) or circuit (e.g., breadboard) With electrical device With particular conductive connection (e.g., crossover) Feedthrough With solder Air cooled, including fins HEAT TRANSMITTER With particular lead geometry With specific electrical feedthrough structure Multiple contact layers separated from each other by insulator means and forming part of a package or housing (e.g., plural ceramic layer package) Cap or lid With provision for cooling the housing or its contents For integrated circuit Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink) For plural devices | |
