Patent ReferencesHeat sink for an electronic pin grid array Low profile integrated heat sink and fan assembly Pentium CPU cooling device EMI shield, and assembly using same Fixing device for fixing electronic component against a wall of a heatsink Patent #: 5373099 InventorApplicationNo. 318921 filed on 10/06/1994US Classes:165/80.3, Air cooled, including fins165/185, HEAT TRANSMITTER174/16.3, With heat sink257/719, Pressed against semiconductor element257/E23.086, Snap-on arrangements, e.g., clips (EPO)257/E23.099, By flowing gases, e.g., air (EPO)361/697, With heat sink or cooling fins361/704Thermal conductionExaminersPrimary: Schwadron, Martin P.Assistant: Leo, L. R. Attorney, Agent or FirmInternational ClassesF28F 007/00H05K 007/20 AbstractA CPU heat sink mounting structure including a CPU, a heat sink attached to one side of the CPU to hold an electric fan for dissipating heat from the CPU, and a plurality of clamps fastened to the heat sink to hold down the CPU, each clamp having a forked mounting portion fastened to a respective retaining hole on the heat sink and a clamping portion clamped on the CPU to hold down the CPU on the heat sink.Field of SearchAir cooled, including finsHEAT TRANSMITTER Radial flow through annular heating or cooling means Mechanical gas pump Heating or cooling means and gas pump in housing With heat sink For integrated circuit Heat dissipating element held in place by clamping or spring means Pressed against semiconductor element With fins With cold plate or heat sink With cooling fins Thermal conduction Heat sink Plural Openings Fan or blower With heat sink or cooling fins | |