GPT system for encapsulating an integrated circuit package
Patent 5420752 Issued on May 30, 1995. Estimated Expiration Date: 
August 18, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 18, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3622419 3706840 3930114 Method of making sealed housings containing delicate structures Compressive pedestal for microminiature connections Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member Semiconductor package Patent #: 5252783 InventorAssigneeApplicationNo. 110281 filed on 08/18/1993US Classes:361/709, Heat sink29/827, Beam lead frame or beam lead device29/855, With encapsulating257/675, With heat sink means257/718, Heat dissipating element held in place by clamping or spring means257/E21.504, Moulds (EPO)257/E23.092, Auxiliary members in encapsulations (EPO)264/272.17, Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)361/723, For lead frame438/122, Possessing thermal dissipation structure (i.e., heat sink)438/124And encapsulatingExaminersPrimary: Tolin, Gerald P.International ClassH05K 007/20AbstractThe present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are nonfunctional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.Field of SearchBeam lead frame or beam lead deviceWith encapsulating, e.g., potting, etc. With molding of insulated base With encapsulating Opposed registering coacting female molds Female mold type means Electrical component encapsulating Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.) Air cooled, including fins HEAT TRANSMITTER With dam or vent for encapsulant With separate tie bar element or plural tie bars With heat sink means With structure for mounting semiconductor chip to lead frame (e.g., configuration of die bonding flag, absence of a die bonding flag, recess for LED) With heat sink Directly attached to semiconductor device Heat dissipating element held in place by clamping or spring means ENCAPSULATED Lead frame Containing silicon or aluminum Integrated circuit With mounting pad With specific lead configuration Shaped lead on board Flexible connecting lead With cold plate or heat sink Thermal conduction With cooling fins Heat sink For integrated circuit Circuit board mounted For printed circuit board For electronic circuit For lead frame | |
