U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Low voltage output buffer with improved speed

Patent 5418476 Issued on May 23, 1995. Estimated Expiration Date: Icon_subject July 28, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

IGFET gating circuit having reduced electric field degradation
Patent #: 4704547
Issued on: 11/03/1987
Inventor: Kirsch

MOS semiconductor integrated circuit in which the production of hot carriers near the drain of a short n channel conductivity type MOS transistor is decreased
Patent #: 4740713
Issued on: 04/26/1988
Inventor: Sakurai ,   et al.

CMOS output circuit using a low threshold device
Patent #: 5057715
Issued on: 10/15/1991
Inventor: Larsen, et al.

Output buffer circuit
Patent #: 5239211
Issued on: 08/24/1993
Inventor: Jinbo

Integrated circuit having a boosted node
Patent #: 5289025
Issued on: 02/22/1994
Inventor: Lee

Output device capable of high speed operation and operating method thereof Patent #: 5343099
Issued on: 08/30/1994
Inventor: Shichinohe

Inventor

Assignee

Application

No. 281899 filed on 07/28/1994

US Classes:

326/58, Complementary FET`s326/81, CMOS327/374, Accelerating switching327/437Complementary metal-oxide semiconductor (CMOS)

Examiners

Primary: Hudspeth, David
Assistant: Calogero, Stephen

Attorney, Agent or Firm

International Classes

H03K 017/16
H03K 019/003

Abstract

An integrated circuit output buffer that operates at a low power supply voltage (e.g., 3.3 volts) shares an I/O bondpad with input circuitry that operates at a higher voltage (e.g., 5 volt) signal level. The higher voltage signal level is typically obtained by connection of the bondpad to a bus that is connected to one or more output buffers on other IC's that operate at the higher power supply voltage level. The inventive output buffer obtains a decreased propagation delay by the use of an additional pull-up transistor in a configuration that protects the low voltage output transistors, including the additional transistor, from the higher voltage signal levels present on the bondpad. In this manner, the output buffer may be used in applications that require the relatively low propagation delay specified for the PCI bus, for example.

Other References

  • IEEE 1992 Custom Integrated Circuits Conference. "3.3V-5V Compatible I/O Circuit Without Thick Gate Oxide". Makoto Takahashi et al. 23.3.1-23.3.4
  • Patent application Ser. No. 08/144,594, filed Oct. 28, 1993, titled "Multi-Voltage Compatible Bidirectional Buffer" by Bernard Lee Morri
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