Thermal stencil plate making method
Patent 5417156 Issued on May 23, 1995. Estimated Expiration Date: 
September 27, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 27, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesThermal plate making apparatus Patent #: 5216951 InventorsAssigneeApplicationNo. 127435 filed on 09/27/1993US Classes:101/128.21, Laminated and/or plural sheets and/or coated base and manufacture101/128.4, Manufacture347/171, THERMAL MARKING APPARATUS OR PROCESSES400/120.13By transfer material or record receiverExaminersPrimary: Burr, Edgar S.Assistant: Funk, Stephen R. Attorney, Agent or FirmForeign Patent References
International ClassB41C 001/055Foreign Application Priority Data1992-10-02 JPAbstractA thermal stencil plate making method, by which a perforation image is formed on a thermal stencil original sheet comprising a thermoplastic resin film and a porous support laminated on each other or a thermal stencil original sheet composed substantially only of a thermoplastic resin film by applying thermal energy to the thermal stencil original sheet by means of a thermal head, is characterized in that a distance between heating elements in the thermal head: d (μm) and a thickness of a heating element protection layer: T (μm) satisfy the following condition of Equation (1) and that a secondary scan direction heating element spacing between heating elements in the thermal head: D (μm) and the thickness of the heating element protection layer: T (μm) satisfy the following condition of Equation (2):5ࣘd/T (1);4.5ࣘD/T (2). | |
