Solder clad substrate
Patent 5415944 Issued on May 16, 1995. Estimated Expiration Date: 
May 2, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 2, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesLow toxicity corrosion resistant solder Soldering method Noncollapsing multisolder interconnection Low temperature-wetting tin-base solder paste Noncollapsing multisolder interconnection Tin-bismuth solder connection having improved high temperature properties, and process for forming same Patent #: 5320272 InventorsAssigneeApplicationNo. 236615 filed on 05/02/1994US Classes:428/567, Continuous interengaged phases of plural metals, or oriented fiber containing361/760, Connection of components to board361/779, With specific connection material428/546, Having metal particles428/548, Composite; i.e., plural, adjacent, spatially distinct metal components (e.g., layers, etc.)428/553, Nonparticulate metal component428/558, Nonparticulate component encloses particles428/559Particles discontinuousExaminersPrimary: Walsh, Donald P.Assistant: Greaves, John N. Attorney, Agent or FirmInternational ClassesB22F 007/00H01L 023/02 AbstractA solder-clad printed circuit board (100) has solder particles of one alloy (120) arranged within a matrix of a second solder alloy (115). This arrangement forms a flat structure that is alloyed to the solder pads (105) on the substrate. The solder particles (120) have a predetermined melting temperature and are made from one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The second solder alloy (115) is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight, and the second solder alloy may comprise about 12% by weight of the solder cladding.Field of SearchHaving metal particlesComposite; i.e., plural, adjacent, spatially distinct metal components (e.g., layers, etc.) Nonparticulate metal component Nonparticulate component encloses particles Particles discontinuous Next to Group IB metal-base component Connection of components to board TIN BASE | |
