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Semiconductor integrated circuits with power reduction mechanism

Patent 5408144 Issued on April 18, 1995. Estimated Expiration Date: Icon_subject January 6, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Inventors

Assignee

Application

No. 178020 filed on 01/06/1994

US Classes:

326/21, SIGNAL SENSITIVITY OR TRANSMISSION INTEGRITY326/98, MOSFET327/544, Power conservation or pulse type327/546, With field-effect transistor365/226POWERING

Examiners

Primary: Hudspeth, David

Attorney, Agent or Firm

International Class

H03K 017/16

Foreign Application Priority Data

1993-01-07 JP

Abstract

This invention is to reduce the power dissipation of a semiconductor integrated circuit chip when it is operated at an operating voltage of 2.5 V or below. To achieve the object, a switching element is provided in each circuit block within the semiconductor integrated circuit chip. The constants of the switching element are set so that the leak current in the switching element of each circuit block in their off-state is smaller than the subthreshold current of the MOS transistors within the corresponding circuit block. The active current is supplied to the active circuit blocks, while the switching elements of the non-active circuit blocks are turned off. Thus, the dissipation currents of the non-active circuit blocks are limited to the leak current value of the corresponding switching elements. As a result, the sum of the dissipation currents of the non-active circuit blocks is made smaller than the active current in the active circuit blocks. Since the dissipation currents of the non-active circuit blocks can be reduced while the active current is caused to flow in the active circuit blocks, the power dissipation in the semiconductor integrated circuit chip can be reduced even in the active state.

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