High temperature, lead-free, tin based solder composition
June 16, 2013. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3607253 3839023 Solder system Tin based ductile brazing alloys Tin based ductile brazing alloys Solder composition Solder composition Low toxicity corrosion resistant solder Soft-solder alloy for bonding ceramic articles Tin base lead-free solder composition containing bismuth, silver and antimony InventorsApplicationNo. 079075 filed on 06/16/1993US Classes:420/561, Antimony, or bismuth containing148/400, STOCK148/405, Age or precipitation hardened or strengthened257/E23.023Consisting of soldered or bonded constructions (EPO)ExaminersPrimary: Andrews, MelvynAssistant: Vincent, Sean Attorney, Agent or FirmInternational ClassC22C 013/00AbstractDisclosed is a lead-free, high solidus temperature, high Sn alloy. The solder alloys contain in excess of 90 weight percent Sn, and an effective amount of Ag and Bi, optionally with Sb or with Sb and Cu. Another form of the alloy contains Ag and Sb, optionally with Bi.Other References
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