Terminal assembly and method of making terminal assembly
Method of making an electronic device using an uniaxial conductive adhesive
Film carrier and bonding method using the film carrier
Temporary soldering aid for manufacture of printed wiring assemblies
Method for mounting a semiconductor chip
Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer Patent #: 5086558
ApplicationNo. 814115 filed on 12/26/1991
US Classes:29/840, By metal fusion29/830, Assembling bases156/273.5, Before and after final assembly257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.021Bump or ball contacts (EPO)
ExaminersPrimary: Arbes, Carl J.
Attorney, Agent or Firm
International ClassH04K 003/34
Foreign Application Priority Data1990-12-26 JP
AbstractA method of connecting an integrated circuit chip to a wiring substrate having a wiring pattern formed thereon. The method is intended to make a connection between fine connecting portions on the substrate and connecting pads on the chip easy and reliable. The connecting method includes connecting a plurality of connecting portions formed on a major surface of a wiring substrate to a plurality of connecting pads formed on a major surface of an integrated circuit chip through metal bumps and adhering portions of the major surface of the wiring substrate which have no connecting portions to portions of the major surface of the integrated circuit chip which have no connecting pads by means of a photothermosetting resin film selectively opened at the connecting portions.